发明名称 |
A SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES |
摘要 |
An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support. |
申请公布号 |
EP1998891(B1) |
申请公布日期 |
2016.08.31 |
申请号 |
EP20070713219 |
申请日期 |
2007.03.07 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
DEKKER, RONALD;PIJNENBURG, REMCO, H., W.;VAN VEEN, NICOLAAS, J., A. |
分类号 |
B01L3/00 |
主分类号 |
B01L3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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