发明名称 A SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES
摘要 An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.
申请公布号 EP1998891(B1) 申请公布日期 2016.08.31
申请号 EP20070713219 申请日期 2007.03.07
申请人 KONINKLIJKE PHILIPS N.V. 发明人 DEKKER, RONALD;PIJNENBURG, REMCO, H., W.;VAN VEEN, NICOLAAS, J., A.
分类号 B01L3/00 主分类号 B01L3/00
代理机构 代理人
主权项
地址