| 摘要 |
A wiring body (3) equipped with an adhesive layer (31), an electrode layer (320) provided on the surface of the adhesive layer (31) on one side thereof, and a lead-out wiring layer (324) integrally formed with the electrode layer (320) and provided on the surface of the adhesive layer (31) on the one side thereof, wherein the lead-out wiring layer (324) has a single-layer structure comprising a material having an identical composition to that of the material constituting the electrode layer (320), and satisfies formula (1). T1<T2 (1) Herein, T1 is the thickness of the electrode layer (320) and T2 is the thickness of the lead-out wiring layer (324) in formula (1). |
