基板重ね合わせ方法、積層半導体装置の製造方法、及び、基板重ね合わせ装置

摘要

PROBLEM TO BE SOLVED: To solve the problem that a relative position of a plurality of substrates is sometimes displaced after positioning and the displacement repeatedly occurs.SOLUTION: A substrate bonding method comprises: a positioning step of mutually positioning a plurality of substrates; a bonding step of bonding the plurality of substrates which are mutually positioned in the positioning step; a detection step of detecting displacement of at least one substrate among the plurality of substrates which are mutually positioned in the positioning step; and an identification step of identifying a position where the displacement detected in the detection step occurs.