| 摘要 |
PROBLEM TO BE SOLVED: To provide a void for preventing the effects of thermal stresses at the time of soldering and thermal stresses due to temperature variations on use, and to readily determine a mounting direction relative to a circuit substrate, at the time of surface mounting in a capacitor having metal terminals. SOLUTION: A composite laminated ceramic capacitor 10 comprises metal terminals 11 each of which has a substantially U-shaped section as a fundamental shape; external electrode layers 10a, 10b which are integrally bonded and fixed substantially to the middle of intermediate portions 11a of the individual metal terminals, and which serve as supports for the capacitor, and voids 13a, 13b which are, respectively, provided between the lowermost portion of the composite built-up ceramic capacitor 10 and end side 11b of the metal terminal 11, an between the uppermost portion of the composite built-up ceramic capacitor 10 and end side 11c of the metal terminal 11. The structure of this capacitor enables arbitrary selecting of either one of the end sides 11b, 11c as a surface- mounting portion which is soldered on the plate surface of a circuit substrate P.
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