发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which can give a molding excellent in mechanical properties such as rigidity, heat resistance, and impact resistance and thermal discoloration resistance and has good moldability. SOLUTION: 100 pts.wt. polyamide resin is mixed with at most 5 pts.wt. thermal discoloration inhibitor being a phosphorous acid and at most 5 pts.wt. flow improver. The flow improver is any one of a polyethylene oxide wax, an aliphatic bisamide, and a metal salt of a higher fatty acid. The polyamide resin is a reinforced polyamide resin in which 0.1-10 wt.% layered silicate is uniformly dispersed on a molecular level.
申请公布号 JPH11315203(A) 申请公布日期 1999.11.16
申请号 JP19980122591 申请日期 1998.05.06
申请人 UNITIKA LTD 发明人 YAMAZAKI MASAAKI;WAKAMURA KAZUYUKI;FUJII HIROSHI
分类号 C08K3/34;C08K5/098;C08K5/20;C08K5/524;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08K3/34
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