| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method, wherein the surface of an object which is to be processed is supplied uniformly with a processing liquid for preventing the contamination of the object. SOLUTION: With a semiconductor wafer W supplied with a processing liquid from a processing liquid supply nozzle 21, the semiconductor wafer W is rotated by a spin chuck 20, while the processing liquid supply nozzle 21 is moved linearly in the horizontal direction or made to move swinging. Thus, the processing liquid is supplied uniformly from a central part to an outer peripheral part of the semiconductor wafer W, for improved uniform process. |
