| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for manufacturing semiconductor device which can save the number of processes for inspection and the number of workers, to improve the cycle time up to shipping of products, and to realize improvement in quality of products. SOLUTION: In the gate forming process to form a gate film of polysilicon, Al, Cu, and W on a semiconductor wafer, passage of time from completion of the resist removing process is supervised after formation of a conductive film (polysilicon, Al, Cu, W or the like) on the semiconductor wafer through the film forming process, resist coating process, exposure process, development process, etching process, and resist removing process (steps S1 to S6), when this passage of time reaches the limited time exceeding the gate resistance value for specifying the electrical characteristics of the semiconductor device, the manufacturing process flow is automatically updated to skip the external appearance inspection to be executed thereafter. Subsequently, the process is continued on the basis of the updated manufacturing process flow. Accordingly, the process can be advanced to the next foreign material inspection step and the cleaning process (steps S8, S9) by skipping the external appearance inspection step. COPYRIGHT: (C)2005,JPO&NCIPI
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