| 摘要 |
An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermined standoff between the package substrate and the mounting substrate. The standoff member comprises a hole provided in the mounting substrate, an insertion portion provided to be contained in the hole, and a standoff portion provided to contact and support the package substrate such that the standoff portion has a height, equivalent to the predetermined standoff, on the mounting substrate and enables relative displacement of the package substrate to the mounting substrate.
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