| 摘要 |
PURPOSE: The substrate processing apparatus and the method for treating substrates using this. The generation of heat caused by the direct current voltage can be shirked. The damage of the bias voltage impressing part by the load increase can be prevented tellingly. CONSTITUTION: The substrate processing apparatus(60) and the method for treating substrates using this. The accepting chamber, bottom electrode, activating electricity application portion, bias power application portion is included. The accepting chamber accepts substrate. In order to be arranged within the accepting chamber and it preserves substrate the bottom electrode is formed. |
