| 摘要 |
PURPOSE: An electronic device is provided to improve heat dissipation performance and to prevent the warp of a package. CONSTITUTION: An electronic device includes a body(2), an electronic device(1), a first heat dissipation layer, a thermal via, and a second electric heat layer. The body is made of a ceramic material. A first insulating layer is arranged on the body. The electronic device is arranged on the first insulating layer which is made of a metal material. The first heat dissipation layer is formed on the center of the lower part of the body. The thermal via is buried inside the body and connects the first insulating layer to the first heat dissipation layer. |
