| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To produce chip type electronic components having two or more elements such as resistor films 2 on a chip type insulating substrate 1 with preparing recessed grooves 6 which divide side electrodes 5 on both sides of the insulating substrate 1 at low cost. <P>SOLUTION: A lot of insulating substrates are arranged and integrated to form a ceramic material board A. On the surface of the board of each insulating substrate, at least two of elements such as resistor films, terminal electrodes and covering coat are formed and then it is primarily divided into a rod-like ceramic material board A' in which a plurality of the insulating substrates are arranged in line. Side-face electrodes are formed on the left and right longer side faces of the rod-like ceramic material broad and then the recessed grooves 6 are carved between the terminal electrodes in both longer side faces by laser irradiation and the rod-like ceramic material board is secondarily divided for each substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
