发明名称 APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR FILM AND LINE BODY FORMED WITH SEMICONDUCTOR FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor film forming apparatus and semiconductor film forming method capable of circumferentially and uniformly forming a semiconductor film on a line body, and to provide a line body formed with a semiconductor film. <P>SOLUTION: The semiconductor film forming apparatus 1 comprises a reaction container 3 that has a cavity 3a therein in which high frequency for excitation supplied from outside resonates; a quartz tube 4 that is attached to the reaction container 3 in such a way that it passes through the inside of the cavity 3a and both ends thereof 4a, 4b project from the reaction container 3; and a plasma reaction unit 5 in the quartz tube 4 in which gas introduced into the quartz tube 4 is excited by the high frequency for excitation supplied in the cavity 3a, and a plasma P is generated. The line body 2 is disposed in the quartz tube 4 having the plasma reaction unit 5 in which the plasma is generated. Therefore, the semiconductor film is circumferentially and uniformly formed on the line body 2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008028231(A) 申请公布日期 2008.02.07
申请号 JP20060200658 申请日期 2006.07.24
申请人 FURUKAWA ELECTRIC CO LTD:THE;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 KURASEKO HIROSHI;NAKAMURA TADAHIRO;TODA SADAYUKI;KOAIZAWA HISASHI;JIA HAIJUN;KONDO MICHIO
分类号 H01L21/205;C23C16/54;H01L31/04 主分类号 H01L21/205
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