发明名称 |
APPARATUS AND METHOD FOR FORMING SEMICONDUCTOR FILM AND LINE BODY FORMED WITH SEMICONDUCTOR FILM |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor film forming apparatus and semiconductor film forming method capable of circumferentially and uniformly forming a semiconductor film on a line body, and to provide a line body formed with a semiconductor film. <P>SOLUTION: The semiconductor film forming apparatus 1 comprises a reaction container 3 that has a cavity 3a therein in which high frequency for excitation supplied from outside resonates; a quartz tube 4 that is attached to the reaction container 3 in such a way that it passes through the inside of the cavity 3a and both ends thereof 4a, 4b project from the reaction container 3; and a plasma reaction unit 5 in the quartz tube 4 in which gas introduced into the quartz tube 4 is excited by the high frequency for excitation supplied in the cavity 3a, and a plasma P is generated. The line body 2 is disposed in the quartz tube 4 having the plasma reaction unit 5 in which the plasma is generated. Therefore, the semiconductor film is circumferentially and uniformly formed on the line body 2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
申请公布号 |
JP2008028231(A) |
申请公布日期 |
2008.02.07 |
申请号 |
JP20060200658 |
申请日期 |
2006.07.24 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY |
发明人 |
KURASEKO HIROSHI;NAKAMURA TADAHIRO;TODA SADAYUKI;KOAIZAWA HISASHI;JIA HAIJUN;KONDO MICHIO |
分类号 |
H01L21/205;C23C16/54;H01L31/04 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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