| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a cured film with excellent durability and heat resistance, a photosensitive resin composition for forming a cured film with excellent durability and heat resistance, even at a low temperature, and an electronic device with high reliability having a pattern of satisfactory shape and characteristic formed of the photosensitive resin composition. <P>SOLUTION: The present invention relates to the photosensitive resin composition containing a polyimide resin having an acid-dissociative group, a compound of generating sulfonic acid by irradiation of light, and a crosslinking agent, a manufacturing method for the pattern using the composition, and the electronic device having the pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT |
