| 摘要 |
Disclosed is an apparatus for molding semiconductor devices, capable of directly supplying a powder-type molding resin without compressing the molding resin into a tablet type. The apparatus includes a mold for molding the semiconductor devices. The mold includes: an upper cavity block having an upper cavity for molding the semiconductor devices; a lower cavity block supporting substrates on which the semiconductor devices are mounted; and a port block which has at least one port into which a powder-type molding resin is supplied, and melts the molding resin so as to provide the molding resin into the upper cavity. Also, the apparatus includes: a carrier for conveying the powder-type molding resin; a resin supply part for supplying the powder-type molding resin into the inside of the carrier; and a resin loader for moving the carrier to the top of the part block in order to supply the powder-type molding resin into the inside of the port. |
