发明名称 Multilayer ceramic substrate and manufacturing method therefor
摘要 A multilayer ceramic substrate includes a ceramic element body including a plurality of stacked ceramic layers, a resistor including a resistance film disposed between the ceramic layers, and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film. The resistance film and the lead via conductor both contain, for example, Ni and Cu that constitute an alloy resistive material. A concentration of the Ni component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom.
申请公布号 US9386696(B2) 申请公布日期 2016.07.05
申请号 US201314136004 申请日期 2013.12.20
申请人 Murata Manufacturing Co., Ltd. 发明人 Banba Shinichiro;Fukuda Yutaka
分类号 H05K1/11;H05K1/16;G01R1/20;H05K1/03;H05K3/42;H05K3/46;G01R3/00 主分类号 H05K1/11
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A multilayer ceramic substrate comprising: a ceramic element body including a plurality of stacked ceramic layers; a resistor including a resistance film disposed between at least two of the ceramic layers; and a lead via conductor penetrating the ceramic layers in a thickness direction and connected at a first end portion to the resistance film; wherein the resistance film and the lead via conductor both contain at least a first metallic component and a second metallic component that constitute an alloy resistive material; and a concentration of the second metallic component in the lead via conductor has a gradient structure that is comparatively high in the first end portion connected to the resistance film and gradually decreases from the first end portion toward a second end portion opposite therefrom; wherein the first metallic component is Cu and the second metallic component is Ni.
地址 Kyoto JP