GLASS PLATE AND MANUFACTURING METHOD THEREFOR

摘要

The present invention addresses the technical problem of contributing to the densification of semiconductor packages by providing: a glass plate that is suitable for supporting a processed substrate used in high-density wiring and has a high end-surface strength; and a manufacturing method for the glass plate. This glass plate is characterized in that the thickness deviation of the entire plate is less than 2.0 μm, and all or a portion of an end surface of the glass plate is a melt-solidified surface.