发明名称 MULTI-LAYER INTERCONNECTED SPIRAL CAPACITOR
摘要 An upper planar capacitor is spaced above a lower planar capacitor by a dielectric layer. A bridged-post inter-layer connector couples the capacitances in parallel, through first posts and second posts. The first posts and second posts extend through the dielectric layer, adjacent the upper and lower planar capacitors. A first level coupler extends under the dielectric layer and couples the first posts together and to a conductor of the lower planar capacitor, and couples another conductor of the lower planar capacitor to one of the second posts. A second level coupler extends above the dielectric layer, and couples the second posts together and to a conductor of the upper planar capacitor, and couples another conductor of the upper planar capacitor to one of the first posts.
申请公布号 US2016240606(A1) 申请公布日期 2016.08.18
申请号 US201514625484 申请日期 2015.02.18
申请人 QUALCOMM Incorporated 发明人 JOW Uei-Ming;SONG Young Kyu;LEE Jong-Hoon;ZHANG Xiaonan
分类号 H01L49/02;H01L23/522 主分类号 H01L49/02
代理机构 代理人
主权项 1. A multi-layer capacitor, comprising: a first level planar capacitor, comprising a first level first trace and a first level second trace; a dielectric layer, arranged over the first level planar capacitor; a second level planar capacitor, arranged over the dielectric layer, comprising a second level first trace and a second level second trace; and a bridged-post inter-layer interconnect, including at least two first posts and at least two second posts, extending through the dielectric layer, adjacent the first level planar capacitor and the second level planar capacitor, a first level first post coupler and a first level second post coupler, under the dielectric layer, wherein the first level first post coupler is configured to couple the at least two first posts together and to the first level first trace, and the first level second post coupler is configured to couple the first level second trace to at least one of the at least two second posts, and a second level first post coupler and a second level second post coupler, over the dielectric layer, wherein the second level second post coupler is configured to couple the at least two second posts together and to the second level first trace, and the second level first post coupler is configured to couple the second level first trace to at least one of the at least two first posts.
地址 San Diego CA US