Vibration dampening compositions

摘要

A curable precursor composition for preparing a vibration dampening composition having a density of less than 0.9 g/cm3 said precursor composition comprising
(i) one or more rigid epoxy resin(ii) one or more flexible epoxy resin,(iii) a first set of hollow microspheres,(iv) a second set of hollow microspheres wherein the microspheres of the first set are different in composition from the microspheres of the second set and,a curing agent capable of cross-linking the rigid and flexible epoxy resins.;Also provided are vibration dampening compositions obtainable from the precursor compositions and methods of preparing such vibration dampening compositions.

主权项

1. A curable two-part precursor composition comprising:
I) part A comprising:
(i) a curing agent that is capable of cross-linking the rigid epoxy resin and the flexible epoxy resin of part B, and II) part B comprising:
(i) one or more rigid epoxy resin,(ii) one or more flexible epoxy resin,(iii) a first set of hollow microspheres which are compressible pre-expanded organic microspheres and have an average diameter of from about 90 μm to 200 μm, and(iv) a second set of hollow microspheres which are inorganic microspheres;wherein curing of the composition is initiated by the combination of the two parts and wherein the composition cures to form a vibration dampening composition having a density of less than 0.9 g/cm3.