| 发明名称 |
SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD |
| 摘要 |
In one embodiment, a substrate treatment apparatus includes a housing configured to house a substrate. The apparatus further includes a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent. The apparatus further includes a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing. |
| 申请公布号 |
US2016293400(A1) |
申请公布日期 |
2016.10.06 |
| 申请号 |
US201514836145 |
申请日期 |
2015.08.26 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KIMURA Shinsuke;KOIDE Tatsuhiko;OGAWA Yoshihiro |
| 分类号 |
H01L21/02;H01L21/67;H01L21/306 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate treatment apparatus comprising:
a housing configured to house a substrate; a chemical supplying module configured to supply one or more chemicals in a gas state to the substrate in the housing, the one or more chemicals including a first chemical that contains a silylation agent; and a cooling module configured to cool the substrate in the housing while any of the one or more chemicals is supplied to the substrate in the housing. |
| 地址 |
Minato-ku JP |
