发明名称 |
Plated material and electric and electronic parts using the plated material |
摘要 |
A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.
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申请公布号 |
US7824776(B2) |
申请公布日期 |
2010.11.02 |
申请号 |
US20080222919 |
申请日期 |
2008.08.19 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
YOSHIDA KAZUO;SUSAI KYOTA |
分类号 |
C25D5/50;B32B15/20;H01R13/03 |
主分类号 |
C25D5/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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