| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin compsn. which is excellent in heat resistance, adhesive properties, dimensional stability, chemical resistance, and dielectric properties and is suitable as a material for insulating layers of multilayered printed circuit boards by compounding an epoxy resin component contg. a trisphenol-based epoxy resin with an epoxy resin curative, a filler, and an org. solvent. SOLUTION: The epoxy resin component contains at least 10 wt.%, pref. 10-60 wt.%, trisphenol-based epoxy resin of formula I [wherein G is glycidyl; each R1 is independently H or a 1-9C alkyl; Y is a group of formula II or III (wherein each R2 is independently H or a 1-4C alkyl); and (a) is 0 or 1], Pref., the epoxy resin curative contains at least one resin selected from among phenol novolak resins, polyhydric phenol compds., and xylylene-modified novolak resins. |
