Plastic package with high heat dissipation and method for manufacturing the same

摘要

The present invention provides a high heat dissipation plastic package (10) and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package (10) with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film (11) is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out (15) for a cavity used to mount a semiconductor element. The Cu foil resin film (11) is bonded using the adhesive resin directly to a heat dissipation plate (12). A conductor wiring pattern is formed on the Cu foil resin film (11). Furthermore, the heat dissipation plate (12) includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film (11).