| 摘要 |
PROBLEM TO BE SOLVED: To propose a manufacturing method for a printed circuit board capable, first of preventing missing of a button, caused by position gap and continuity failure at a time of patterning, and secondly, of preventing disconnections inside a through-hole and fault of disconnection at pretreatment for overlay treatment. SOLUTION: This manufacturing method is related to a substrate 6, with a copper foil F attached on both sides of an insulator 7. The method comprises, first a process of arranging a large number of pierced holes 2 for a through-hole 1; a process of performing electrical conduction inside the pierced hole 2; secondly, a process of covering the substrate 6 with photosensitive dry film and, to develop and stiffen as a plating resist; and then a process of performing copper coating 5, inside the pierced hole 2 and the periphery of an aperture 3. Thereafter, this manufacturing method further comprises a process of covering the copper plating 5 with a metal protection coating 9, then a process of removing the photosensitive dry film, and then, a process of forming a circuit pattern A and thereafter, after-treatment process of performing overlay treatment. COPYRIGHT: (C)2007,JPO&INPIT |
