| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device, correcting misalignment due to bending in the positional relationship between a grinding wheel and a wafer caused by grinding resistance to uniformly chamfer both sides of the wafer. SOLUTION: This wafer chamfering device includes: a first sensor 21 for detecting one side surface position of the wafer W; and a second sensor 22 for detecting the other side surface position of the wafer W, wherein a rotating axis direction moving means 14 is controlled so that the detection value of the one side surface of the wafer W obtained by the first sensor 21 is equal to the detection value of the other side surface of the wafer W to locate the wafer W in the center of a groove 19a of the grinding wheel 19, whereby both sides of the wafer W can be chamfered equally with respect to the center of thickness of the wafer. COPYRIGHT: (C)2007,JPO&INPIT
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