<p>The component bearer element has at least one board for accommodating components of microsystem technology and a cover that screens the components against the exterior. At least one thermal insulation arrangement is provided that screens the board and the cover both internally and externally in some areas.</p>
申请公布号
EP1221726(B1)
申请公布日期
2007.10.17
申请号
EP20010129506
申请日期
2001.12.11
申请人
ABB RESEARCH LTD.
发明人
BINZ, DIETER, DR.;VOGEL, ALBRECHT, DR.;KRIPPNER, PETER, DR.