SILICONE RESIN COMPOSITION, SILICON RESIN CURED ARTICLE AND OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION BODY

摘要

PROBLEM TO BE SOLVED: To provide a silicon resin composition having extremely excellent interfacial adhesiveness and excellent adhesiveness even under high temperature and high humidity, a silicone resin curd article using the silicone resin composition and an optical semiconductor element encapsulation body.SOLUTION: There is provided a silicone resin composition containing a silicone resin mixture and an adhesiveness adding agent which is a compound having a structural unit represented by the formula (3), where I=0, between a silane structural unit having a carbonyl group.SELECTED DRAWING: None