发明名称 |
SEMICONDUCTOR PACKAGES |
摘要 |
Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter. |
申请公布号 |
US2016240509(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615135364 |
申请日期 |
2016.04.21 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KWON Heungkyu;LEE Kang Joon;YOO JaeWook;LEE Su-Chang |
分类号 |
H01L25/065;H01L23/31;H01L23/00 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Suwon-si KR |