| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment and a heat treatment method, enabling a substrate to be accurately heat-treated with high efficiency with simple control.SOLUTION: An upper plate 21 on which a substrate W is placed, is cooled or heated by a heat treatment part 23. A temperature of the heat treatment part 23 is adjusted by a temperature adjustment part 30. A temperature of the upper plate 21 is detected. A control value to be given to the temperature adjustment part 30 to keep the temperature of the upper plate 21 at a set value, is calculated as a control calculation value on the basis of the detected temperature. When the control calculation value is lowered to be less than a second threshold value, a first control to give the control calculation value to the temperature adjustment part 30 is performed. When the control calculation value is raised to be a first threshold value or more, a second control to give a control set value higher than the control calculation value to the temperature adjustment part 30, is performed.SELECTED DRAWING: Figure 1 |
