| 发明名称 |
ENCAPSULATED PAYLOADS BONDED TO POLYMERIC MATERIALS |
| 摘要 |
In an example, a process for bonding a microcapsule having an encapsulating payload to a polymeric material. The process includes applying a microcapsule (having the encapsulated payload) that includes a dienophile functional group to a polymeric material that includes a diene functional group. The process further includes bonding the microcapsule having the encapsulated payload to the polymeric material via a chemical reaction of the dienophile functional group with the diene functional group. |
| 申请公布号 |
US2016311992(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201514693027 |
申请日期 |
2015.04.22 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Kuczynski Joseph;Wertz Jason T.;Zhang Jing |
| 分类号 |
C08J7/12;C11B9/00;A01N25/28 |
主分类号 |
C08J7/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A process for bonding a microcapsule having an encapsulated payload to a polymeric material, the process comprising:
applying a microcapsule having an encapsulated payload to a polymeric material, wherein the microcapsule having the encapsulated payload includes a dienophile functional group, and wherein the polymeric material includes a diene functional group; and bonding the microcapsule having the encapsulated payload to the polymeric material via a chemical reaction of the dienophile functional group with the diene functional group. |
| 地址 |
Armonk NY US |
