发明名称 Moldable earpiece system
摘要 An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear.
申请公布号 AU2013216867(B2) 申请公布日期 2016.12.01
申请号 AU20130216867 申请日期 2013.02.08
申请人 Decibullz LLC 发明人 Kirkpatrick, Kyle J.
分类号 H04R1/10 主分类号 H04R1/10
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