| 发明名称 |
THREE DIMENSIONAL STRUCTURES WITHIN MOLD COMPOUND |
| 摘要 |
A method including forming at least one passive structure on a substrate by a build-up process; introducing one or more integrated circuit chips on the substrate; and introducing a molding compound on the at least one passive structure and the one or more integrated circuit chips. A method including forming at least one passive structure on a substrate by a three-dimensional printing process; introducing one or more integrated circuit chips on the substrate; and embedding the at least one passive structure and the one or more integrated circuit chips in a molding compound. An apparatus including a package substrate including at least one three-dimensional printed passive structure and one or more integrated circuit chips embedded in a molding material. |
| 申请公布号 |
US2016358897(A1) |
申请公布日期 |
2016.12.08 |
| 申请号 |
US201414778036 |
申请日期 |
2014.12.09 |
| 申请人 |
INTEL CORPORATION |
发明人 |
ALBERS Sven;WOLTER Andreas;REINGRUBER Klaus;MEYER Thorsten |
| 分类号 |
H01L25/16;H01L23/31;H01L21/56;H01L23/498;H01L49/02;H01L21/683 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
forming at least one passive structure on a substrate by a build-up process; introducing one or more integrated circuit chips on the substrate; and introducing a molding compound on the at least one passive structure and the one or more integrated circuit chips. |
| 地址 |
Santa Clara CA US |
