SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which does not invite deterioration in performance of electrostatic discharge, suppressing an increase in size of a semiconductor chip associated with an increase in the number of electrode pads.

SOLUTION: A plurality of electrode pads 1a and 1b for external connection are arranged in a staggered shape. The electrode pad 1a and an input/output cell 2 in a side near a scribing area 3 are arranged in such a manner that the positions of the ends of them are set to be substantially the same. Protection circuits 6 and 7 against electrostatic discharge are arranged. The power side protection circuit 7 and the ground side protection circuit 6 are sequentially positioned from a side near the scribing area 3. A distance between the center positions of the electrode pad 1a and the ground side protection circuit 7 of the input/output cell 2 of itself and a distance between the center positions of the electrode pad 1b and the ground side protection circuit 7 of the input/output cell 2 of itself are short and are substantially the same between the input/output cells 2. Resistance to electrostatic discharge becomes strong.

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