| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a semiconductor device package capable of preventing a defect of a seal ring part and a connection part for electrical connection that may occur during the production process for mounting a semiconductor device package on an external circuit substrate via its solder ball; and a method for manufacturing and mounting the same. <P>SOLUTION: The semiconductor device package comprises a semiconductor device, a substrate assembly arranged so as to oppose the semiconductor device, a solder seal ring that closely seals the semiconductor device and the substrate assembly, and a number of solder balls provided on the outer circumferential edge of the solder seal ring of the substrate assembly, wherein the melting point of the solder seal ring is higher than the melting point of the solder ball. <P>COPYRIGHT: (C)2008,JPO&INPIT |
