| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for suppressing generation of a whisker without removing a plating layer.SOLUTION: An electronic component having a resin part 11 and a terminal 14 in a substrate 10 is joined by soldering. The resin 11 includes an element or the like of the electric component, and the terminal 14 is connected to the element or the like included by the resin part 11. An Sn-based plating layer 16 is formed on a front surface of the terminal 14, and covers a whole of the front surface of terminal 14. When a solder is supplied to a bottom end part of the terminal 14 and is melted, a joint part 22 obtained by joining the solder and the plating layer 16 is formed by diffusing Sn of the solder to the plating layer 16. A position higher than the joint part 22 does not contact with the solder, and the plating layer 16 remains there. When the solder is melted, a flux including the solder rises the front surface of the terminal 14. Therefore, after complete solidification of the solder, a whole region of the front surface of the plating layer 16 positioned at the upper side of the joint part 22 is covered with the flux 18.SELECTED DRAWING: Figure 2 |
