发明名称 Array Pressure-Sensing Imaging Device
摘要 An array pressure sensing imaging device is provided. The array pressure-sensing imaging device includes a flexible surface sensing layer, a pressure sensing layer, a three-dimensional pressure sensing layer, a pressure adjustment layer laminated in a sequence and communicatively connected to a control unit.
申请公布号 US2016162079(A1) 申请公布日期 2016.06.09
申请号 US201514804951 申请日期 2015.07.21
申请人 BOE Technology Group Co., Ltd. ;HEFEI BOE Optoelectronics Technology Co., Ltd. 发明人 Jing Yangkun;Wu Xing
分类号 G06F3/045;H05K1/02;H05K1/09;G06F1/16 主分类号 G06F3/045
代理机构 代理人
主权项 1. An array pressure-sensing imaging device, comprising a flexible surface sensing layer, a pressure sensing layer, a three-dimensional pressure sensing layer, a pressure adjustment layer and a control unit; wherein the flexible surface sensing layer senses and transmits flatness information of a surface of the pressed object to the control unit; the pressure sensing layer senses and transmits information of a force in the vertical direction between the pressed object and the array pressure-sensing imaging device to the control unit; the three-dimensional pressure sensing layer senses and transmits information of a force in the horizontal direction between the pressed object and the array pressure-sensing imaging device to the control unit; the control unit sends a control command to the pressure adjustment layer to adjust the force applied on the pressed object by the array pressure-sensing imaging device based on the received flatness information of the surface of the pressed object and the information of the force in the vertical and/or horizontal direction between the pressed object and the array pressure-sensing imaging device.
地址 Beijing CN