发明名称 |
Array Pressure-Sensing Imaging Device |
摘要 |
An array pressure sensing imaging device is provided. The array pressure-sensing imaging device includes a flexible surface sensing layer, a pressure sensing layer, a three-dimensional pressure sensing layer, a pressure adjustment layer laminated in a sequence and communicatively connected to a control unit. |
申请公布号 |
US2016162079(A1) |
申请公布日期 |
2016.06.09 |
申请号 |
US201514804951 |
申请日期 |
2015.07.21 |
申请人 |
BOE Technology Group Co., Ltd. ;HEFEI BOE Optoelectronics Technology Co., Ltd. |
发明人 |
Jing Yangkun;Wu Xing |
分类号 |
G06F3/045;H05K1/02;H05K1/09;G06F1/16 |
主分类号 |
G06F3/045 |
代理机构 |
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代理人 |
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主权项 |
1. An array pressure-sensing imaging device, comprising a flexible surface sensing layer, a pressure sensing layer, a three-dimensional pressure sensing layer, a pressure adjustment layer and a control unit;
wherein the flexible surface sensing layer senses and transmits flatness information of a surface of the pressed object to the control unit; the pressure sensing layer senses and transmits information of a force in the vertical direction between the pressed object and the array pressure-sensing imaging device to the control unit; the three-dimensional pressure sensing layer senses and transmits information of a force in the horizontal direction between the pressed object and the array pressure-sensing imaging device to the control unit; the control unit sends a control command to the pressure adjustment layer to adjust the force applied on the pressed object by the array pressure-sensing imaging device based on the received flatness information of the surface of the pressed object and the information of the force in the vertical and/or horizontal direction between the pressed object and the array pressure-sensing imaging device. |
地址 |
Beijing CN |