| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an MEMS (micro-electro-mechanical sensor) sensor (for example, capacitance acceleration sensor) that can efficiently increase the mass of a movable weight portion and is freely and easily manufactured using a CMOS (complementary metal-oxide semiconductor) process using multilayer wiring. <P>SOLUTION: This MEMS sensor 100A includes the movable weight portion 120A, that is connected to a supporting portion 110 via a connection section 130A, includes first and second gap parts 111 and 112 in its periphery, and moves in the Z direction. The movable weight 120A includes a stacked structure, having a plurality of conductive layers, an interlayer insulating layer arranged between the plurality of conductive layers, and plugs that are charged into an embedding groove pattern penetrated and formed in the interlayer insulating layer and have a specific gravity larger than that of the interlayer insulation film. The plugs include a wall portion, formed in a wall shape in at least one axial direction of a two-dimensional plane parallel to the interlayer insulating layer. One among the plurality of conductive layers is a movable electrode portion 140A, having a movable electrode surface, and a fixed electrode portion 150A is disposed so as to face it. <P>COPYRIGHT: (C)2011,JPO&INPIT |
