| 发明名称 | Image sensor device with flexible interconnect layer and related methods | ||
| 摘要 | An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface. | ||
| 申请公布号 | US9385153(B2) | 申请公布日期 | 2016.07.05 |
| 申请号 | US201514740468 | 申请日期 | 2015.06.16 |
| 申请人 | STMICROELECTRONICS PTE LTD | 发明人 | Luan Jing-En |
| 分类号 | H01L27/00;H01L27/146 | 主分类号 | H01L27/00 |
| 代理机构 | Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. | 代理人 | Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A. |
| 主权项 | 1. An image sensor device comprising: an interconnect layer comprising a dielectric layer, and at least one electrical conductor carried internally in said dielectric layer; said interconnect layer having an opening extending therethrough; an image sensor integrated circuit (IC) within the opening and having an image sensing surface; an infrared (IR) filter aligned with the image sensing surface; an encapsulation material laterally surrounding said image sensor IC and filling the opening; and a flexible interconnect layer coupled to said interconnect layer opposite the image sensing surface. | ||
| 地址 | Singapore SG | ||