发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which a wire length can be shortened.SOLUTION: A wiring board 10 comprises a first substrate 11 in which a pad P1 for component connection is formed in the uppermost layer of the wiring board, an electronic component 40 mounted on an upper surface of the first substrate 11, and an electrode terminal 42 formed in the electronic component 40 and provided in the position adjacent to the pad P1 for component connection in a plan view. The wiring board 10 further includes a connection member 60 formed on the pad P1 for component connection and electrically connecting the pad P1 for component connection and the electrode terminal 42. The connection member 60 includes a columnar core part 61, and a solder layer 62 covering the periphery of the core part 61 and joined to the pad P1 for component connection. The solder layer 62 spreads in a plane direction from the core part 61, and includes a swollen part 63 joined to the electrode terminal 42.SELECTED DRAWING: Figure 1
申请公布号 JP2016122796(A) 申请公布日期 2016.07.07
申请号 JP20140263381 申请日期 2014.12.25
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MACHIDA KIYOHIRO
分类号 H05K3/34;H01L21/60;H05K1/14;H05K3/36;H05K3/46 主分类号 H05K3/34
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