| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing sheet that can properly seal a semiconductor chip when forming a sealing body containing a semiconductor chip embedded in the sealing sheet.SOLUTION: A sealing sheet satisfies a condition that the ratio B/A calculated according to the procedure of the following steps A to D ranges from not less than 0.7 to not more than 1. A step A of preparing a sample having a size of 20 cm in longitudinal length, 20 cm in lateral length and 400 μm in thickness, a step B of applying pressure to the prepared sample vertically to the surface of the sample until the thickness becomes 300 μm, a step C of releasing the pressure applied in the step B, and a step D of calculating the ratio B/A between the thickness A of X after the step C and the thickness B of Y after the step C when X represents a central part of the sample and Y represents a part which is, before the pressure is applied to the sample, at 2 cm from one side of the sample in the direction of the central part X.SELECTED DRAWING: Figure 1 |
