| 发明名称 | Lid body, package, electronic apparatus, moving object, and method for manufacturing package | ||
| 摘要 | A lid body includes: a first surface; a second surface having a top-bottom relation with the first surface; an outer peripheral surface connecting the first surface and the second surface; a groove provided in the first surface from the outer peripheral surface toward an interior of the first surface; and first and second marks arranged at positions that do not overlap with an outer peripheral edge of the second surface in a plan view. | ||
| 申请公布号 | US9516773(B2) | 申请公布日期 | 2016.12.06 |
| 申请号 | US201414537132 | 申请日期 | 2014.11.10 |
| 申请人 | Seiko Epson Corporation | 发明人 | Matsuzawa Juichiro |
| 分类号 | H01L41/053;H03B5/30;H03H9/10;H05K5/06;H05K5/02;H01L23/04;H01L21/50;H01L23/544 | 主分类号 | H01L41/053 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A lid body sealed to a container, the lid body comprising: a first surface; a second surface opposite the first surface; an outer peripheral surface connecting the first surface and the second surface; a groove provided in the first surface and extending partially into the lid body towards the second surface without extending completely to the second surface, the groove extending inwardly from the outer peripheral surface; and a mark provided at the second surface, the mark being located at a position that does not overlap with an outer peripheral edge of the second surface in a plan view, wherein a portion of the lid where the groove is provided is melted to form an airtight seal between the lid body and the container. | ||
| 地址 | JP | ||