发明名称 |
Method for producing printed wiring board |
摘要 |
A method for producing a printed wiring board which is capable of forming an insulating layer having a surface with low roughness and high adhesion strength to a conductive layer and of achieving an excellent performance in removal of smear, involves the following steps (A) to (F) in this order: (A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which includes a support and a resin composition layer in contact with the support so that the resin composition layer is in contact with the internal layer circuit substrate; (B) thermally curing the resin composition layer of the resin sheet with a support to form an insulating layer; (C) perforating the insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling the support; and (F) forming a conductive layer on a surface of the insulating layer. |
申请公布号 |
US9516765(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201314065924 |
申请日期 |
2013.10.29 |
申请人 |
Ajinomoto Co., Inc. |
发明人 |
Nakamura Shigeo;Morikawa Yukinori;Yokota Tadahiko |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A method for producing a printed wiring board, comprising (A) to (F) in this order:
(A) laminating, onto an internal layer circuit substrate, a resin sheet with a support which comprises a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with said internal layer circuit substrate; (B) thermally curing said resin composition layer of said resin sheet with a support to form an insulating layer; (C) perforating said insulating layer to form a via hole; (D) performing a desmear treatment; (E) peeling said support, to expose a surface of said insulating layer; and (F) forming a conductive layer on the surface of said insulating layer, wherein said resin composition layer of said resin sheet with a support comprises at least one epoxy resin, at least one curing agent, and at least one inorganic filler, said at least one curing agent comprises an active ester-based curing agent and a curing agent selected from the group consisting of a phenol-based curing agent and a naphthol-based curing agent, said at least one inorganic filler is treated with at least one surface treatment agent selected from the group consisting of an organosilazane compound, a titanate-based coupling agent, an aminosilane-based coupling agent, an epoxysilane-based coupling agent, and a mercaptosilane-based coupling agent, and said at least one inorganic filler is present in said resin composition layer in an amount of 72% by mass to 95% by mass, when a content of nonvolatile components in said resin composition layer is defined as 100% by mass. |
地址 |
Chuo-ku JP |