发明名称 Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
摘要 Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.
申请公布号 US9516748(B2) 申请公布日期 2016.12.06
申请号 US201314407074 申请日期 2013.06.14
申请人 OSRAM GMBH 发明人 Yang Jianghui;Zhong Chuanpeng;Li Hao;Chen Xiaomian
分类号 H05K1/05;H05K1/02;H05K1/18;H05K1/03;H05K3/10;H05K1/14 主分类号 H05K1/05
代理机构 Viering, Jentschura & Partner mbB 代理人 Viering, Jentschura & Partner mbB
主权项 1. A circuit board, comprising a base and an electric-conducting layer, wherein the base has a first region and a second region on one side thereof facing the electric-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities, wherein the second region is configured to be flat, and wherein the first insulating layer and the second insulating layer are fixedly connected through a solder.
地址 Munich DE