发明名称 Sn-PLATED MATERIAL AND METHOD OF PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an Sn-plated material which exhibits excellent fretting wear resistance when used as a material of an insertable and removable connection terminal or the like, and a method of producing the same.SOLUTION: The method of producing the Sn-plated material is provided that comprises: forming a Ni layer 16 with a thickness of 0.1 to 1.5 μm on a base material 10 composed of copper or a copper alloy by electroplating; then forming an Sn-Cu plating layer 12 with a thickness of 0.6 to 10 μm in which Sn 12b is mixed with a Cu-Sn alloy 12a, by an electroplating using a Sn-Cu plating bath having a Cu content of 5 to 35 mass% based on total amount of Sn and Cu; and then forming an Sn layer 14 with a thickness of 1 μm or less by the electroplating if needed.SELECTED DRAWING: Figure 4
申请公布号 JP2016211031(A) 申请公布日期 2016.12.15
申请号 JP20150094832 申请日期 2015.05.07
申请人 DOWA METALTECH KK;YAZAKI CORP 发明人 KOTANI HIROTAKA;NARUEDA HIROTO;ENDO HIDEKI;SUGAWARA AKIRA;SONODA YUTA;KONDO TAKAYA;TOYOIZUMI JUN;KISHIHATA YUYA
分类号 C25D7/00;C25D5/10;C25D5/12;H01R13/03 主分类号 C25D7/00
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