发明名称 |
Sn-PLATED MATERIAL AND METHOD OF PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an Sn-plated material which exhibits excellent fretting wear resistance when used as a material of an insertable and removable connection terminal or the like, and a method of producing the same.SOLUTION: The method of producing the Sn-plated material is provided that comprises: forming a Ni layer 16 with a thickness of 0.1 to 1.5 μm on a base material 10 composed of copper or a copper alloy by electroplating; then forming an Sn-Cu plating layer 12 with a thickness of 0.6 to 10 μm in which Sn 12b is mixed with a Cu-Sn alloy 12a, by an electroplating using a Sn-Cu plating bath having a Cu content of 5 to 35 mass% based on total amount of Sn and Cu; and then forming an Sn layer 14 with a thickness of 1 μm or less by the electroplating if needed.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016211031(A) |
申请公布日期 |
2016.12.15 |
申请号 |
JP20150094832 |
申请日期 |
2015.05.07 |
申请人 |
DOWA METALTECH KK;YAZAKI CORP |
发明人 |
KOTANI HIROTAKA;NARUEDA HIROTO;ENDO HIDEKI;SUGAWARA AKIRA;SONODA YUTA;KONDO TAKAYA;TOYOIZUMI JUN;KISHIHATA YUYA |
分类号 |
C25D7/00;C25D5/10;C25D5/12;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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