发明名称 SLURRY SUPPLYING APPARATUS AND METHOD, AND POLISHING APPARATUS AND METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a slurry supplying apparatus and method, and a polishing apparatus and method which are capable of maintaining a supply amount of slurry at a constant. SOLUTION: This slurry supplying apparatus 20 for supplying slurry 22 to an article to be polished has a slurry tank 21 for storing the slurry 22, a pump 24 for pumping the slurry 22 stored in the slurry tank 21, a flow meter 26 for measuring a flow rate of the slurry 22 sucked by the pump 24, a controller 27 for controlling a suction operation of the pump 24 based on the measurement of the flow meter 26, and a three-way valve 29 for switching a flow of the slurry 22 passing through the flow meter 26 between a side of the slurry tank 21 and a side of the article to be polished.</p>
申请公布号 JP2000317811(A) 申请公布日期 2000.11.21
申请号 JP19990130150 申请日期 1999.05.11
申请人 TOSHIBA CORP 发明人 FUJITA HIROSHI;INO TAKAO;HIRABAYASHI HIDEAKI
分类号 B24B37/00;(IPC1-7):B24B37/00 主分类号 B24B37/00
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