A PROCESS FOR THE CONTAMINATION-TOLERANT BONDING OF SUBSTRATES

摘要

The introduction of vibration energy into the uncured adhesive matrices during and/or after the joining of workpieces leads to the effectiv e dissolution and/or dispersion of adhesion-reducing contamination of the substrate surfaces into the adhesive matrix. In many cases, this can reduce the cost of expensive cleaning processes or quality control measures. More particularly, the effect of the concluding pretreatment and cleaning of the substrates in the adhesive is to preclude any adhesion- reducing recontamination.