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经营范围
发明名称
Resin filler and multilayer printed wiring board
摘要
申请公布号
EP1318708(B1)
申请公布日期
2004.10.20
申请号
EP20030004268
申请日期
1996.10.23
申请人
IBIDEN CO., LTD.
发明人
KAWAMURA, YOICHIRO;MURASE, HIDEKI;ASAI, MOTOO
分类号
H05K3/00;H05K3/38;H05K3/46;(IPC1-7):H05K3/46
主分类号
H05K3/00
代理机构
代理人
主权项
地址
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