| 摘要 |
PROBLEM TO BE SOLVED: To provide a box type facing target sputtering system where the damage of the lower layer is reduced, and a thin film of high quality can be deposited at a low temperature. SOLUTION: Regarding the box type facing target sputtering system, a box type facing sputtering unit 70 where one face 71f among the six side faces 71a to 71f in a frame body 71 with the shape of a rectangular parallelpiped is made into an opened side face; a pair of facing target parts 100a and 100b provided with targets and magnetic field generating means provided therearound and consisting of permanent magnets forming magnetic fields of a facing mode in a direction vertical to the target face and magnetic fields of a magnetron mode in a direction parallel to the target face are installed in the facing both side faces adjacent to the opening side face; and the other side faces 71 to 71e are shielded with shielding plates 72c to 72e (71c and 72c are located at this sides, and are not shown in the figure) is fitted to a vacuum vessel 11 in the opening side face, and a substrate 20 is arranged inside the vacuum vessel so as to be faced to the opening part of the opening side face to deposit a thin film on the substrate, the plasma space at the inside of the box type facing sputtering unit 70 is provided with an auxiliary electrode 201a absorbing electrons. COPYRIGHT: (C)2005,JPO&NCIPI
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