发明名称 SEMICONDUCTOR WAFER PROCESSOR AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor wafer processor capable of enhancing the effect for ejecting particles from a processing tank without producing unevenness in the concentration of a processing liquid. SOLUTION: There are provided the processing tank 10 for receiving a semiconductor wafer 40 whose upper face is opened, a processing liquid supplying means 20 connected to a processing liquid supplying source 24 storing a processing liquid for processing the semiconductor wafer 40 and supplies the processing liquid into the processing tank 10, and a bubble forming means 30 arranged on the upper part of the inner wall of the processing tank 10 and forms bubbles in the processing liquid so that the bubbles will not impinge on the semiconductor wafer 40. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344792(A) 申请公布日期 2006.12.21
申请号 JP20050169468 申请日期 2005.06.09
申请人 TOSHIBA CORP 发明人 TOMITA HIROSHI
分类号 H01L21/027;H01L21/304;H01L21/306 主分类号 H01L21/027
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