| 摘要 |
A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2 ; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted; and a coating member 4 which covers a surface of the light emitting element mounting member 3 where said light emitting elements 2 are mounted. In the semiconductor light emitting device 1 , said light emitting element mounting member 3 is provided with depressed sections 7 at positions where said light emitting elements 2 are respectively mounted; said coating member 4 is provided with through holes at positions respectively corresponding to the depressed sections 7 ; inner wall surfaces of (i) each of the depressed sections 7 and (ii) each of the through holes respectively form (i) a first reflection surface 8 and (ii) a second reflection surface 9 ; and the second reflection surface 9 has an angle with respect to an optical axis of said light emitting element 2 smaller than an angle of said first reflection surface 8 with respect to an optical axis of said light emitting element 2.
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