| 摘要 |
A polishing pad includes a plurality of polishing surfaces, a first group of the polishing surfaces made of a first material having a first coefficient of friction and a second group of the polishing surfaces made of a second material having a second coefficient of friction. The first and second groups of polishing surfaces may be arranged over the polishing pad so as to provide a non-planar material removal profile. The polishing surface layout may be designed by evaluating a material removal profile for an existing polishing pad of known characteristics, observing how variations in polishing surface densities and/or coefficients of friction affect that material removal profile, and then mapping the polishing surface coefficients of friction and density profiles to the subject polishing pad layout.
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